Founded in Aichi pref., Japan in 1996, Technoserve co., ltd, formerly Nagata
Tekko co., ltd has reached its eighth anniversary in February 2004.
Company lately has been acknowledged as the world leader in thermal plasma
technology for its uniqueness and originality that no one can overtake
it. TSV is contributing to work out solutions for customers that have various
requests by :
DC plasma applied apparatuses
・ Air plasma spray apparatus
・ Atmosphere controlled plasma spray apparatus
・ Plasma heating apparatus
・ Plasma melting apparatus
・ Plasma spherodizing apparatus
・ X-Y traversing apparatus
・ Atmosphere controlled spray chamber
・ Plasma torch
・ Plasma burner
・ Plasma heater |
Powder feeder
・ Constant capacity type conventional powder feeder
・ Local fluiding type fine powder feeder
・ Surface tracking type universal powder feeder
・ Feedrate meter
・ Liner powder spray apparatus
・ Powder jet etching apparatus |
In recent years, TSV has developed the new micro plasma splay system by
its proprietary powder-feed technology and the new micro plasma torch which
enables to provide powder directly into the plasma axis. It has been widely
noticed as the sole splay system that can comply with various requests
oriented toward nano technology.
Though small compared to other companies, we have unparalleled technology reach in the world.
TSV
never forgets our faith of “Challenge
creates future”, and we are sure to be stubbornly honest to make dreams of
technology come true.
|
